Content

In the first part of the course we discuss the chemical aspects, as well as the theoretical and fundamental background w.r.t. surface treatment and manufacturing of thin films. The second part deals with characterization techniques used to characterize these layers and surfaces. In the third part, a number of specific cases can be treated, allowing students to do guided self study (in this part, the students are also expected to prepara a paper).

- Treatment of surfaces and production of thin films – background
- Growth of silicon and germanium single crystals as start materials
o Defects in silicon
o Doping and diffusion
- Thin film deposition
o Thermal oxidation of silicon
o Chemical Vapor Deposition of dielectric and conducting layers
o Epitaxial layer growth
o Sputter based deposition of thin films
o Deposition of low-k dielectrica (e.g. spin on)
- Photolithograhy and patterning
o Photoresist materials
o Overview of etch processes
- Chemical cleaning of semiconductor surfaces
o Ultra clean processing
o Photoresis and etch residue removal
o Chemical Mechanical Polishing 

Course material

Recommended literature (not mandatory - course notes will be provided)

- Silicon processing for the VLSI Era – process technology, S.Wolf – R.N.Tauber, Lattice Press, Sunset Beach, California, US ,1999- Nanoelectronics and Information Technology – advanced electronic materials and novel devices, R.Waser, Wiley – VCH, Weinheim, Germany, 2005

Language of instruction: more information

The course and slides are in English.

Format: more information

The course consists of ex cathedra lectures (see content).

In addition, the students are required to prepare a paper (on a topic related to the course topics).

Content

In the first part of the course we discuss the chemical aspects, as well as the theoretical and fundamental background w.r.t. surface treatment and manufacturing of thin films. The second part deals with characterization techniques used to characterize these layers and surfaces. In the third part, a number of specific cases can be treated, allowing students to do guided self study (in this part, the students are also expected to prepara a paper).

-  Mass spectrometry
   * Matrix Assisted Laser Desorption/Ionization technique (MALDI)
   * Time of Flight/Secondary Ion Mass Spectromertry (TOF-SIMS)
   * Applications in chemical and biomedical technologies
-  Surface techniques
   * Grazing-angle FT-IR
   * Contact angle
   * Polarography and Cyclic Voltametry
   * Surface Plasmon Resonance
   * Quartz Microbalance
   * Total Reflexion X-ray Fluorescence (TXRF)
   * Ellipsometry
 

Course material

Recommended literature (not mandatory - course notes are foreseen)

- Silicon processing for the VLSI Era – process technology, S.Wolf – R.N.Tauber, Lattice Press, Sunset Beach, California, US ,1999- Nanoelectronics and Information Technology – advanced electronic materials and novel devices, R.Waser, Wiley – VCH, Weinheim, Germany, 2005

Language of instruction: more information

The course and notes are in English

Format: more information

The students are required to prepare and present a paper related to a topic of the course.