Aims

The aim of this course is to understand system technologies used for the fabrication of IC's, electronic and optoelectronic systems.

Previous knowledge

Necessary basis to disciplines as offered in the introductory courses H01M3A Elektronische basisschakelingen; H06F2A Semiconductor physics and ; H06F0A Semiconductor devices.
Materials Physics and technology for nanoelectronics, .

Content

This course handles BASIC (OLA H09M6a ) and ADVANCED topics (OLA H06G0a) of both the technology of Integrated Circuits (Part I) and the technologies for System Integration (Part II)
Part I: Integrated Circuits

The hearth of micro and nano-electronics is the integrated circuit (IC), where on a tiny Silicon chip complex systems containing up to billions of transistors are integrated

The objective of this part of the course is to learn about the IC fabrication technology, with focus on CMOS:
-          General concept and merits of planar technology.
-          Study of process flows and basic process steps
-          How CMOS technology could be scaled to the advanced nano-technology of today
-          What are current and future evolutions and issues
o       possibilities and barriers for further scaling
o       classical top down vs bottom up
o       planar vs. 3D processing
Further, some examples of other application fields will be given that also use "CMOS" technology concepts, e.g.
-          memory technology
-          large-area electronics
By that, it will be shown that the technology concept studied is not only limited to classical electronics, and furthermore that high-tech is not only the realization of a very scaled CMOS devices, but can be also the use of these processes for building new types of functional structures, even with relative large dimensions.

Part II: System integration

Electronic systems fabrication can be viewed as an assembly and packaging of a number of components. For today's advanced systems, the typical components are complex integrated circuits (so called Silicon chips), that are studied in Part II of this course. However, for the system to be optimally performing, the "assembly" techniques are crucial, and with the advancement of the performance of the IC, also different and more complex assembly techniques have been developed to match ultimate system requirements. Furthermore, new applications have emerged, as RF and biomedical, that demand specific system form factors and/or encapsulations. Hence, system integration has gone a long way from soldering Dual-In-Line packaged ICs on a Printed Circuit Board…

The purpose of this part of the course is to understand  the technology of combining and packaging integrated circuits:
-          techniques on Si level, including wafer-level packaging, multi-chip modules and 3D integration
-          first level packaging and bonding
-          application dependent second level packaging (e.g. RF, sensor, biomedical)
Furthermore, the course wants to give more general insights in mechanical properties and thermal management relevant for building electronic systems. Finally, alternative routes, as optical interconnect, are discussed. 
2) relation with research
 
The content of this course is very strongly related to research at ESAT-INSYS/imec on nanotechnology, including  innovative process steps for chip assembly and packaging, further scaling of electronic devices, as well  as investigating novel functional structures for a possibly broad range of applications.

Course material

Text book
Toledo / e-platform
Slides, transparencies, courseware

Order of Enrolment

Mixed prerequisite:
You may only take this course if you comply with the prerequisites. Prerequisites can be strict or flexible, or can imply simultaneity. A degree level can be also be a prerequisite.
Explanation:
STRICT: You may only take this course if you have passed or applied tolerance for the courses for which this condition is set.
FLEXIBEL: You may only take this course if you have previously taken the courses for which this condition is set.
SIMULTANEOUS: You may only take this course if you also take the courses for which this condition is set (or have taken them previously).
DEGREE: You may only take this course if you have obtained this degree level.


SIMULTANEOUS (H06G4A)

The codes of the course units mentioned above correspond to the following course descriptions:
H06G4A : Materials Physics and Technology for Nanoelectronics

This course unit is a prerequisite for taking the following course units:
H06L6B : Project Work Nanoscience
H06E1B : Practical Design for Nanotechnology

Is also included in other courses

• Erasmus Mundus Master of Science in Nanoscience and Nanotechnology 120 ects.
• Master of Nanoscience and Nanotechnology (new programme, starts in 2012-2013) 120 ects.