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Prerequisites
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Language of instruction
Duration
LevelMicrosystems and Sensors (B-KUL-H06C9A)
Aims
This course aims at bringing insight to the student on the possiblities of creating microstructures, mainly based upon the techniques normally used in standard IC manufacturing. It highlights several MEMS devices.
Previous knowledge
No specific prerequisites are mandatory, beside necessary basis to disciplines as offered in the introductory courses H01M3A Elektronische basisschakelingen and ; H06F0A Semiconductor devices and decent knowledge of basic physics and mechanics. Some know-how on electronic circuits is also required.
Content
This course gives an overview of the recent developments in the creation of microelectromechanical structures (MEMS) in silicon. Both sensors and actuators are discussed. Main focus is towards miniaturisation. Finally, some examples of complete operational systems are shown, and problems such as interconnection, packaging and reliability come under focus. Introduction MST - MEMS - Micromachines Motivation: - miniaturisation, portability, monolithicity Micromaching Bulk micromachining Surface micromachining Spark erosion (EDM) Dry etching (DRIE) Wafer bonding techniques CAD fo MEMS Sensors Pressure sensors, flow sensors, velocity sensors and accelerometers Radiation sensors Optical sensors and CCD structures Hall effect sensors Chemical sensoren Actuators Drive mechanisms Micropumps and microfluidics Micromotors X-Y manipulators Systems for probing Atomic force microprobes (AFM) Diskette heads Integrated systems Signal treatement on the MEMS-chip Strategies for intelligent sensors and systems Packaging aspects Interconnectiesystems, assembly and packages Realiability aspects.
Course material
Toledo / e-platform
Text book
Is also included in other courses
- Doctoraatsopleiding in de Bio-ingenieurswetenschappen
- Master in de bio-ingenieurswetenschappen: biosysteemtechniek (Major: Bionanotechnology) 120 ects.
- Master of Nanoscience and Nanotechnology (no new enrolments in 2012-2013) (Engineering) 120 ects.
-
Erasmus Mundus Master of Science in Nanoscience and Nanotechnology
120 ects.
-
Master of Engineering: Biomedical Engineering
120 ects.
- Master of Engineering: Electrical Engineering (new programme, starts in 2011-2012) (Electronics and Integrated Circuits) 120 ects.
- Master of Engineering: Electrical Engineering (new programme, starts in 2011-2012) (Embedded Systems and Multimedia) 120 ects.
- Master of Nanoscience and Nanotechnology (new programme, starts in 2012-2013) (Option: Nanodevices and Nanophysics) 120 ects.
Activities
2.41 ects. Microsystems and Sensors: Lecture (B-KUL-H06C9a)
Content
This course gives an overview of the recent developments in the creation of microelectromechanical structures (MEMS) in silicon. Both sensors and actuators are discussed. Main focus is towards miniaturisation. Finally, some examples of complete operational systems are shown, and problems such as interconnection, packaging and reliability come under focus. Introduction MST - MEMS - Micromachines Motivation: - miniaturisation, portability, monolithicity Micromaching Bulk micromachining Surface micromachining Spark erosion (EDM) Dry etching (DRIE) Wafer bonding techniques CAD fo MEMS Sensors Pressure sensors, flow sensors, velocity sensors and accelerometers Radiation sensors Optical sensors and CCD structures Hall effect sensors Chemical sensoren Actuators Drive mechanisms Micropumps and microfluidics Micromotors X-Y manipulators Systems for probing Atomic force microprobes (AFM) Diskette heads Integrated systems Signal treatement on the MEMS-chip Strategies for intelligent sensors and systems Packaging aspects Interconnectiesystems, assembly and packages Realiability aspects.
Aims
This course aims at bringing insight to the student on the possiblities of creating microstructures, mainly based upon the techniques normally used in standard IC manufacturing. It highlights several MEMS devices.
Course material
S. Fransilla: Introduction to Microfabrication (suggested to buy)
G. Kovacs: Micromachined Transducers
N. Maluf: An Introduction to Microelectromechanical Systems Engineering
S. Senturia: Microsystem Design
0.59 ects. Microsystems and Sensors: Exercises and Laboratory Sessions (B-KUL-H06D0a)
Content
This course gives an overview of the recent developments in the creation of microelectromechanical structures (MEMS) in silicon. Both sensors and actuators are discussed. Main focus is towards miniaturisation. Finally, some examples of complete operational systems are shown, and problems such as interconnection, packaging and reliability come under focus. Introduction MST - MEMS - Micromachines Motivation: - miniaturisation, portability, monolithicity Micromaching Bulk micromachining Surface micromachining Spark erosion (EDM) Dry etching (DRIE) Wafer bonding techniques CAD fo MEMS Sensors Pressure sensors, flow sensors, velocity sensors and accelerometers Radiation sensors Optical sensors and CCD structures Hall effect sensors Chemical sensoren Actuators Drive mechanisms Micropumps and microfluidics Micromotors X-Y manipulators Systems for probing Atomic force microprobes (AFM) Diskette heads Integrated systems Signal treatement on the MEMS-chip Strategies for intelligent sensors and systems Packaging aspects Interconnectiesystems, assembly and packages Realiability aspects.
Course material
G. Kovacs: Micromachined Transducers
N. Maluf: An Introduction to Microelectromechanical Systems Engineering
S. Senturia: Microsystem Design
Evaluation
Evaluation : Microsystems and Sensors (B-KUL-H26C9a)
Explanation
The seminar, performed at the end of the excersise sessions, is quoted for 20% of the total of the points for this course
Exam : oral without written preparation
